Invention Grant
- Patent Title: Tile saw
- Patent Title (中): 瓷砖锯
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Application No.: US12148972Application Date: 2008-04-24
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Publication No.: US07823575B2Publication Date: 2010-11-02
- Inventor: Michael L. O'Banion , Daniel Puzio , Jason D. Hardebeck
- Applicant: Michael L. O'Banion , Daniel Puzio , Jason D. Hardebeck
- Applicant Address: US DE
- Assignee: Black & Decker Inc.
- Current Assignee: Black & Decker Inc.
- Current Assignee Address: US DE
- Agent Rhonda L. Barton; Adan Ayala
- Main IPC: B28D1/32
- IPC: B28D1/32

Abstract:
A saw includes a base, a table supported above the base and configured to support a workpiece, an arm coupled to and extending above the base, and a saw unit supported by the arm so that the saw unit is disposed above the table. A first rail is fixedly coupled to the base and extends in a longitudinal direction, and a first bearing member is coupled to the table. The first bearing member moves along the first rail so that the table is moveable relative to the base in the longitudinal direction between a cantilevered position and an uncantilevered position, without any movement of the table relative to the first bearing member. The first bearing member is directly in contact with the first rail in both the cantilevered and uncantilevered positions.
Public/Granted literature
- US20080216808A1 Tile saw Public/Granted day:2008-09-11
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