Invention Grant
- Patent Title: Manufacturing method and manufacturing apparatus of printed wiring board
- Patent Title (中): 印刷电路板的制造方法和制造装置
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Application No.: US11528539Application Date: 2006-09-28
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Publication No.: US07823762B2Publication Date: 2010-11-02
- Inventor: Yoichiro Kawamura , Katsuhiko Tanno , Masanori Iriyama , Sho Akai
- Applicant: Yoichiro Kawamura , Katsuhiko Tanno , Masanori Iriyama , Sho Akai
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN Co., Ltd.
- Current Assignee: IBIDEN Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: B23K31/12
- IPC: B23K31/12
Abstract:
A solder ball is loaded on a bump having a small height (FIG. 5(B)) and the height of the bump is intensified by melting the solder ball by heating with laser (FIG. 5(C)). Thus, the heights of the bumps are adjusted within a requested allowable range. Because the bump is not removed by heating when the height of the low bump is intensified, the printed wiring board is not subjected to local heat history thereby intensifying reliability of the bump of a printed wiring board.
Public/Granted literature
- US20080078810A1 Manufacturing method and manufacturing apparatus of printed wiring board Public/Granted day:2008-04-03
Information query
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