Invention Grant
- Patent Title: Fluid-ejection device service station
- Patent Title (中): 流体喷射装置维修站
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Application No.: US11807469Application Date: 2007-05-29
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Publication No.: US07824003B2Publication Date: 2010-11-02
- Inventor: Anthony D. Studer , Donald Lee Michael , Kevin E. Swier
- Applicant: Anthony D. Studer , Donald Lee Michael , Kevin E. Swier
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A service station for use with a fluid ejection device having a fluid-ejection mechanism with at least one nozzle includes a housing configured to attach to the fluid-ejection mechanism and to remain attached to the fluid-ejection mechanism during the fluid-ejection operation. A shutter arranged within the housing includes at least one opening, and is selectively moveable between a closed position and an open position with respect to the nozzle. In the open position the opening exposes the nozzle and in the closed position the nozzle is covered. An actuation mechanism separate from the housing is positioned to selectively couple with the shutter, such that activation of the actuation mechanism causes the shutter to move between the open and closed positions.
Public/Granted literature
- US20080204503A1 Fluid-ejection device service station Public/Granted day:2008-08-28
Information query
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