Invention Grant
- Patent Title: Liquid ejection device
- Patent Title (中): 液体喷射装置
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Application No.: US11511801Application Date: 2006-08-29
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Publication No.: US07824005B2Publication Date: 2010-11-02
- Inventor: Yuji Yakura , Masahiro Koike , Shota Nishi , Yasuhiro Tanaka
- Applicant: Yuji Yakura , Masahiro Koike , Shota Nishi , Yasuhiro Tanaka
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rockey, Depke & Lyons, LLC
- Agent Robert J. Depke
- Priority: JP2005-255690 20050902; JP2006-167884 20060616
- Main IPC: B41J2/165
- IPC: B41J2/165

Abstract:
A liquid ejection device includes: a liquid ejection head which includes an ejection surface and an ejection port formed at the ejection surface, ejects a droplet of liquid from the ejection port, and allows the liquid to land on an object; an elastic absorbing member which comes into contact with the ejection surface of the liquid ejection head, and absorbs the liquid adhering to the ejection surface; and moving means for moving the absorbing member with respect to the ejection surface while the absorbing member is in contact with the ejection surface, in which the absorbing member has a surface layer which is impregnated with a solution containing a surfactant.
Public/Granted literature
- US20070057990A1 Liquid ejection device Public/Granted day:2007-03-15
Information query
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