An injection molding system includes a mold having a hot half and a cold half, the hot half including a hot runner. A bus transceiver is located in the mold. At least one electrical device associated with the operation of the mold is located in the mold and electrically coupled to the bus transceiver. A controller for controlling the mold is located outside the mold. A bus line electrically couples the controller to the bus transceiver of the electrical device apparatus includes an injection manifold having an inlet and a melt channel.