Invention Grant
- Patent Title: System for resin curing
- Patent Title (中): 树脂固化系统
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Application No.: US11774303Application Date: 2007-07-06
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Publication No.: US07824165B2Publication Date: 2010-11-02
- Inventor: Alistair Davie , Joseph Pelleja
- Applicant: Alistair Davie , Joseph Pelleja
- Applicant Address: CA Burlington, Ontario
- Assignee: Comtek Advanced Structures Limited
- Current Assignee: Comtek Advanced Structures Limited
- Current Assignee Address: CA Burlington, Ontario
- Agent Patrick J. Hofbauer
- Priority: CA2551728 20060706
- Main IPC: B29C35/08
- IPC: B29C35/08

Abstract:
Among other things, there is disclosed a system for curing a resin in a composite structure having one or more interconnected cure volumes, the cure volumes having one or more heatable surface zones. The system comprises a mould comprising a mould base portion adapted to support the composite structure and a mould closure portion adapted to overlie the mould base portion in sealable relation to define a mould chamber containing the composite structure within. The system further comprises a plurality of heating units each selectively positionable about the mould. The heating units transmit heat to the mould by radiation, and the mould heats the one or more surface zones of the cure volumes.
Public/Granted literature
- US20090011063A1 SYSTEM FOR RESIN CURING Public/Granted day:2009-01-08
Information query
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