Invention Grant
- Patent Title: High density connector
- Patent Title (中): 高密度连接器
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Application No.: US12587341Application Date: 2009-10-05
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Publication No.: US07824187B1Publication Date: 2010-11-02
- Inventor: Chong Yi
- Applicant: Chong Yi
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Ming Chieh Chang; Wei Te Chung; Andrew C. Cheng
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00
Abstract:
An electrical connector system comprises a first PCB assembly (100) comprising a first PCB (10) and a first electrical connector (20) mounted on said first PCB (10) and a second PCB assembly (300) comprising a second PCB (30) perpendicular to the first PCB (10) and a second electrical connector (40) mounted on said second PCB (30). The first electrical connector (20) is formed with a port and the second electrical connector (40) is also formed with a port matable into the port of the first electrical connector (20), so that the first PCB assembly (100) is mountable to the second PCB assembly (300) along a first direction (120) parallel to the first PCB (10) and the second PCB (30).
Information query
