Invention Grant
- Patent Title: Modular connector system
- Patent Title (中): 模块化连接器系统
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Application No.: US12576691Application Date: 2009-10-09
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Publication No.: US07824197B1Publication Date: 2010-11-02
- Inventor: John Eugene Westman , Brian Keith McMaster, Jr. , Michael W. Fogg
- Applicant: John Eugene Westman , Brian Keith McMaster, Jr. , Michael W. Fogg
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R4/66
- IPC: H01R4/66

Abstract:
A connector assembly includes a contact module, signal contacts, and a ground contact. The contact module includes a dielectric body with mating and mounting edges and corresponding opposite back edges. The signal contacts are held within the contact module. The signal contacts include mating and mounting ends that protrude from the mating and mounting edges of the contact module, respectively. The signal contacts are arranged in a differential pair to convey differential signals. The ground contact is coupled to the contact module and includes mating and mounting ends that protrude from the mating and mounting edges of the contact module, respectively. The ground contact runs alongside the back edges of the contact module from the mounting edge to the mating edge.
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