Invention Grant
- Patent Title: Connector
- Patent Title (中): 连接器
-
Application No.: US12155964Application Date: 2008-06-12
-
Publication No.: US07824222B2Publication Date: 2010-11-02
- Inventor: Toshiharu Miyoshi , Kenji Miki
- Applicant: Toshiharu Miyoshi , Kenji Miki
- Applicant Address: JP Yao-shi, Osaka
- Assignee: Hosiden Corporation
- Current Assignee: Hosiden Corporation
- Current Assignee Address: JP Yao-shi, Osaka
- Agency: Bacon & Thomas, PLLC
- Priority: JP2007-172303 20070629
- Main IPC: H01R9/03
- IPC: H01R9/03

Abstract:
The invention provides a connector in which, in an over-mold process, it is possible to prevent a molten resin from flowing through inevitable gaps (88, 89) of a shell (80) into the inside of the shell, thereby preventing problems such as that movable portions of contacts (20) become immovable, from arising. The connector of the invention has a plug body (10) in which contacts (20) to be connected to a cable (70) are held by an insulative body (40), the body (40) is shielded by a shell (80) formed by a metal plate, and a part of the plug body (10) is over-molded. The body (40) has sealing portions (41, 42) which are fitted into gaps (88, 89) of the shell (80) to close the gaps (88, 89).
Public/Granted literature
- US20090004916A1 Connector Public/Granted day:2009-01-01
Information query