Invention Grant
- Patent Title: Connecting terminal
- Patent Title (中): 连接端子
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Application No.: US12311179Application Date: 2007-10-03
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Publication No.: US07824236B2Publication Date: 2010-11-02
- Inventor: Shigeru Sawada , Hideo Hoshi
- Applicant: Shigeru Sawada , Hideo Hoshi
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: Autonetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Oliff & Berridge, PLC
- Priority: JP2006-271467 20061003
- International Application: PCT/JP2007/069356 WO 20071003
- International Announcement: WO2008/041721 WO 20080410
- Main IPC: H01R11/01
- IPC: H01R11/01

Abstract:
A connecting terminal developed speedily while limiting a temperature rise when a current flows, comprising male and female terminals each having a wire crimp portion to which a wire is crimped, and a joint portion where the male and female terminals are joined to each other, wherein a contact resistance value of the whole connecting terminal is a sum of contact resistance values in the wire crimp portions and the joint portion, and a length of a contact portion is a sum of lengths of the wire crimp portions and the joint portion, wherein a normalized contact resistance value Rter is derived by dividing the contact resistance value by the length, and a relationship of a wire resistance value Rwire of the wire, a current value I and a permissive increase in temperature ΔT to the normalized contact resistance value Rter is expressed by Rter
Public/Granted literature
- US20090239425A1 Connecting terminal Public/Granted day:2009-09-24
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