Invention Grant
- Patent Title: Chemical mechanical planarization methods
- Patent Title (中): 化学机械平面化方法
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Application No.: US11765815Application Date: 2007-06-20
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Publication No.: US07824243B2Publication Date: 2010-11-02
- Inventor: Tien-Chen Hu , Jung-Sheng Hou , Chun-Chin Huang
- Applicant: Tien-Chen Hu , Jung-Sheng Hou , Chun-Chin Huang
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: B24B49/00
- IPC: B24B49/00 ; B24B51/00
Abstract:
A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.
Public/Granted literature
- US20080318494A1 CHEMICAL MECHANICAL PLANARIZATION METHODS AND APPARATUS Public/Granted day:2008-12-25
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