Invention Grant
- Patent Title: Methods and apparatus for polishing a semiconductor wafer
- Patent Title (中): 抛光半导体晶片的方法和装置
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Application No.: US11807783Application Date: 2007-05-30
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Publication No.: US07824244B2Publication Date: 2010-11-02
- Inventor: Gregory Eisenstock , John Christopher Thomas
- Applicant: Gregory Eisenstock , John Christopher Thomas
- Applicant Address: US NY Corning
- Assignee: Corning Incorporated
- Current Assignee: Corning Incorporated
- Current Assignee Address: US NY Corning
- Agent Bruce P. Watson; Matthew Dernier
- Main IPC: B24B49/12
- IPC: B24B49/12

Abstract:
Methods and apparatus provide for: a base on which a substrate may be releasably coupled; a moving belt located with respect to the base such that a contact surface thereof is operable to remove material from a top surface of the substrate; and a plurality of actuators, at least two of which are independently controllable, located with respect to the base and the moving belt such that a corresponding plurality of pressure zones are defined to provide pressure between the moving belt and the top surface of the substrate.
Public/Granted literature
- US20080299871A1 Methods and apparatus for polishing a semiconductor wafer Public/Granted day:2008-12-04
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