Invention Grant
- Patent Title: Wheel spindle device for grinding machine
- Patent Title (中): 磨床用主轴装置
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Application No.: US12131593Application Date: 2008-06-02
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Publication No.: US07824246B2Publication Date: 2010-11-02
- Inventor: Tomohiro Inagaki , Tomoyasu Imai , Takayuki Moroto , Shinji Soma
- Applicant: Tomohiro Inagaki , Tomoyasu Imai , Takayuki Moroto , Shinji Soma
- Applicant Address: JP Okazaki-shi JP Osaka-shi
- Assignee: Toyoda Van Moppes Ltd.,JTEKT Corporation
- Current Assignee: Toyoda Van Moppes Ltd.,JTEKT Corporation
- Current Assignee Address: JP Okazaki-shi JP Osaka-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-151981 20070607
- Main IPC: B24B49/00
- IPC: B24B49/00

Abstract:
In a wheel spindle device wherein a plurality of grinding wheels are attached in a juxtaposed relation to a wheel spindle rotatably carried on a wheel head of a grinding machine, a reference position for specifying a position in the circumferential direction of the grinding wheel is provided on a core member of each of the grinding wheels, and a plurality of inclined grooves at predetermined angular intervals are formed on a grinding surface of each grinding wheel to be inclined relative to the circumferential direction of each grinding wheel. In order that the fluctuations in the dynamic pressure and the grinding resistance between respective grinding wheels and workpiece portions ground therewith do not grow as a combined or synergy effect, the inclined grooves on each grinding wheel are shifted in angular phase from those on another grinding wheel, so that grinding efficiency and accuracy can be enhanced.
Public/Granted literature
- US20080305726A1 WHEEL SPINDLE DEVICE FOR GRINDING MACHINE Public/Granted day:2008-12-11
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