Invention Grant
- Patent Title: Polishing material having polishing particles and method for making the same
- Patent Title (中): 具有抛光颗粒的抛光材料及其制造方法
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Application No.: US11702217Application Date: 2007-02-05
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Publication No.: US07824249B2Publication Date: 2010-11-02
- Inventor: Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung , Chao-Yuan Tsai
- Applicant: Chung-Chih Feng , I-Peng Yao , Lyang-Gung Wang , Yung-Chang Hung , Chao-Yuan Tsai
- Applicant Address: TW
- Assignee: San Fang Chemical Industry Co., Ltd.
- Current Assignee: San Fang Chemical Industry Co., Ltd.
- Current Assignee Address: TW
- Agency: Sughrue Mion, PLLC
- Main IPC: B24D15/00
- IPC: B24D15/00 ; B24D11/00 ; B24B1/00

Abstract:
The present invention relates to a polishing material having polishing particles and a method for making the same. The polishing material having polishing particles includes a base material, a plurality of polishing particles and a polymer elastic body. The base material has a plurality of fibers for defining a plurality of grid-spaces. The polishing particles are distributed in the grid-spaces. The polymer elastic body covers the base material and the polishing particles, whereby, the polishing particles are uniformly distributed on a surface of a polishing workpiece during the polishing process. Furthermore, the base material prevents the polishing particles from contacting the polishing workpiece so as to avoid scratching of the polishing workpiece. Also, the base material provides effects for sweeping the small grinded pieces.
Public/Granted literature
- US20080188168A1 Polishing material having polishing particles and method for making the same Public/Granted day:2008-08-07
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