Invention Grant
- Patent Title: Expandable spherical spinal implant
- Patent Title (中): 可扩展球形脊柱植入物
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Application No.: US10801975Application Date: 2004-03-16
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Publication No.: US07824444B2Publication Date: 2010-11-02
- Inventor: Robert S. Biscup , Clayton G. Leroux
- Applicant: Robert S. Biscup , Clayton G. Leroux
- Applicant Address: US OH Avon
- Assignee: Spineco, Inc.
- Current Assignee: Spineco, Inc.
- Current Assignee Address: US OH Avon
- Agency: Fay Sharp LLP
- Agent Brian E. Turung
- Main IPC: A61F2/44
- IPC: A61F2/44
Abstract:
A prosthetic implant for forming a support structure between adjoining vertebrae in a spinal column. The prosthetic implant includes a generally spherical or ellipsoidal body that at least partially engages a surface of adjacent vertebrae.
Public/Granted literature
- US20040186576A1 Expandable spherical spinal implant Public/Granted day:2004-09-23
Information query
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