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US07824496B2 Container, container producing method, substrate processing device, and semiconductor device producing method 有权
容器，容器制造方法，基板处理装置以及半导体装置的制造方法

Container, container producing method, substrate processing device, and semiconductor device producing method
Abstract:
A pressure resistant case (22) is constructed in a rectangular parallelepiped box shape by assembling a bottom plate (61) and ceiling plate (62) and first side plate (63) and second side plate (64) and third side plate (65) and a fourth side plate (66) formed of thick aluminum plate and by welding on four sides by the TIG welding method. In the TIG welding of the ceiling plate (62) and the first side plate (63), the end surface on the side where a hollow section (72) of the ceiling plate (62) is formed, abuts against the main surface on the side where the locating section (71) of the first side plate (63) is formed. The edge near the hollow section (72) of the ceiling plate (62) is abutted against the locating section (71), and a fillet weld section (75) is formed by TIG welding on the corner section formed by the ceiling plate (62) and the locating section (71). The heat capacity of the hollow section of the ceiling plate and the locating section for TIG welding is small so that the fillet weld section can be formed even in aluminum plate possessing a high thermal conductivity. The vacuum performance, etc. of the pressure resistant case can be maintained since the slit formed between the contact surfaces is blocked by the fillet weld section.
Abstract(Chinese):

通过组装底板（61）和顶板（62）以及第一侧板（63）和第二侧板（64）和第三侧板（65），将耐压外壳（22）构造成矩形平行六面体箱形， 以及由厚铝板形成的第四侧板（66），并且通过TIG焊接方法在四边焊接。 在天花板（62）和第一侧板（63）的TIG焊接中，形成有顶板（62）的中空部（72）一侧的端面抵接在顶板 形成第一侧板（63）的定位部（71）的一侧。 靠近顶板（62）的中空部分（72）的边缘抵靠定位部分（71），并且通过TIG焊接在由顶板（62）形成的角部上形成角焊部分（75） ）和定位部（71）。 天花板的中空部分和TIG焊接的定位部分的热容量小，即使在具有高导热性的铝板中也可以形成角焊缝部分。 由于形成在接触面之间的狭缝被角焊部分阻挡，因此可以保持耐压壳体的真空性能等。

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