Invention Grant
- Patent Title: Coating for reducing contamination of substrates during processing
- Patent Title (中): 用于减少加工过程中底物污染的涂层
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Application No.: US10786876Application Date: 2004-02-24
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Publication No.: US07824498B2Publication Date: 2010-11-02
- Inventor: Vijay D. Parkhe , Kurt J. Ahmann , Matthew C. Tsai , Steve Sansoni
- Applicant: Vijay D. Parkhe , Kurt J. Ahmann , Matthew C. Tsai , Steve Sansoni
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agent Ashok K. Janah
- Main IPC: C23C16/00
- IPC: C23C16/00 ; H01L21/306 ; H01L21/683 ; C23F1/00 ; B23B31/38
Abstract:
A substrate support has a support structure and a coating on the support structure having a carbon-hydrogen network. The coating has a contact surface having a coefficient of friction of less than about 0.3 and a hardness of at least about 8 GPa. The contact surface of the coating is capable of reducing abrasion and contamination of a substrate that contacts the contact surface. In one version, the support structure has a dielectric covering an electrode. A plurality of mesas on the dielectric have a coating with the contact surface thereon.
Public/Granted literature
- US20050183669A1 Coating for reducing contamination of substrates during processing Public/Granted day:2005-08-25
Information query
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