Invention Grant
- Patent Title: Method for flattening glass substrate
- Patent Title (中): 平板玻璃基板的方法
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Application No.: US11527292Application Date: 2006-09-26
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Publication No.: US07824564B2Publication Date: 2010-11-02
- Inventor: Kazuyuki Hiroki
- Applicant: Kazuyuki Hiroki
- Applicant Address: JP Tokyo JP Tokyo JP Osaka-Shi
- Assignee: Casio Computer Co., Ltd.,Sanwa Frost Industries Co., Ltd.,Nagase & Co., Ltd.
- Current Assignee: Casio Computer Co., Ltd.,Sanwa Frost Industries Co., Ltd.,Nagase & Co., Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo JP Osaka-Shi
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2006-058941 20060306; JP2006-165580 20060615
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method for flattening a glass substrate includes the steps of preparing plural kinds of etching liquids different from one another in an etching rate, preparing the glass substrate, and etching the glass substrate at least one time with each of the etching liquids and executing the etching a plurality of times in total. When the etchings are executed the plurality of times, an etching rate of the glass substrate with one etching liquid used for one etching of plural etchings is slower than that of the glass substrate with the another etching liquid used for another etching executed after the one etching process of the plural etching processes.
Public/Granted literature
- US20070207623A1 Method for flattening glass substrate Public/Granted day:2007-09-06
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