Invention Grant
- Patent Title: Solution for forming polishing slurry, polishing slurry and related methods
- Patent Title (中): 抛光浆,抛光浆及其相关方法的研究
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Application No.: US11465176Application Date: 2006-08-17
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Publication No.: US07824568B2Publication Date: 2010-11-02
- Inventor: Joseph K. V. Comeau , Marina M. Katsnelson , Matthew T. Tiersch , Eric J. White
- Applicant: Joseph K. V. Comeau , Marina M. Katsnelson , Matthew T. Tiersch , Eric J. White
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Anthony Canale
- Main IPC: C09K13/00
- IPC: C09K13/00

Abstract:
A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.
Public/Granted literature
- US20080042099A1 SOLUTION FOR FORMING POLISHING SLURRY, POLISHING SLURRY AND RELATED METHODS Public/Granted day:2008-02-21
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