Invention Grant
- Patent Title: Bond line forming method
- Patent Title (中): 键线形成方法
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Application No.: US11534364Application Date: 2006-09-22
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Publication No.: US07824592B2Publication Date: 2010-11-02
- Inventor: Sjef van Breugel , Willem Bakhuis , Andy Billen
- Applicant: Sjef van Breugel , Willem Bakhuis , Andy Billen
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Global Patent Operation
- Agent Douglas D. Zhang
- Main IPC: B29C65/54
- IPC: B29C65/54
Abstract:
A method for forming a bond between a first and a second shell of a blade is provided. The method comprises the steps of forming a cavity between said first and second blade shells and filling an adhesive into said cavity to form a bond line between said first and second blade shells.
Public/Granted literature
- US20080075603A1 BOND LINE FORMING METHOD Public/Granted day:2008-03-27
Information query
