Invention Grant
- Patent Title: Silicon dioxide dispersion
- Patent Title (中): 二氧化硅分散体
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Application No.: US10524037Application Date: 2003-07-29
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Publication No.: US07824643B2Publication Date: 2010-11-02
- Inventor: Kai Schumacher , Monika Oswald
- Applicant: Kai Schumacher , Monika Oswald
- Applicant Address: DE Essen
- Assignee: Evonik Degussa GmbH
- Current Assignee: Evonik Degussa GmbH
- Current Assignee Address: DE Essen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: DE10239144 20020827
- International Application: PCT/EP03/08332 WO 20030729
- International Announcement: WO2004/020334 WO 20040311
- Main IPC: C01B33/12
- IPC: C01B33/12 ; C01B33/18

Abstract:
Stable, aqueous dispersion containing silicon dioxide powder having a hydroxyl group density of 2.5 to 4.7 OH/nm2, which is obtained from a silicon dioxide powder produced by a flame hydrolysis process under acid conditions. The dispersion is produced by incorporating the silicon dioxide powder into an aqueous solution by means of a dispersing device. The dispersion can be used to produce glass articles.
Public/Granted literature
- US20060093542A1 Silicon dioxide dispersion Public/Granted day:2006-05-04
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