Invention Grant
US07824734B2 Method of preparing a substrate having a layer or pattern of metal on it
失效
制备其上具有金属层或图案的基材的方法
- Patent Title: Method of preparing a substrate having a layer or pattern of metal on it
- Patent Title (中): 制备其上具有金属层或图案的基材的方法
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Application No.: US12036688Application Date: 2008-02-25
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Publication No.: US07824734B2Publication Date: 2010-11-02
- Inventor: Jurina Wessels , Bjoern Luessem , Akio Yasuda , Daniel Schwaab , Dirk Mayer , Andreas Offenhaeusser , Sandra Gilles
- Applicant: Jurina Wessels , Bjoern Luessem , Akio Yasuda , Daniel Schwaab , Dirk Mayer , Andreas Offenhaeusser , Sandra Gilles
- Applicant Address: DE Berlin DE Juelich
- Assignee: Sony Deutschland GmbH,Forschungszentrum Juelich GmbH
- Current Assignee: Sony Deutschland GmbH,Forschungszentrum Juelich GmbH
- Current Assignee Address: DE Berlin DE Juelich
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: EP07006696 20070330
- Main IPC: B05D1/36
- IPC: B05D1/36
Abstract:
A method and associated substrate is provided for applying a layer or pattern of metal on a substrate. The method includes providing a target substrate, immobilizing a layer of polymeric material on the target substrate, and applying and immobilizing a layer or pattern of metal on the layer of polymeric material on the target substrate using a stamp onto which the layer or pattern of metal has previously been applied, by bringing the stamp into conformal contact with the target substrate.
Public/Granted literature
- US20080241491A1 METHOD OF PREPARING A SUBSTRATE HAVING A LAYER OR PATTERN OF METAL ON IT Public/Granted day:2008-10-02
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