Invention Grant
- Patent Title: Micro patch coating device and method
- Patent Title (中): 微贴片装置及方法
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Application No.: US11806094Application Date: 2007-05-30
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Publication No.: US07824736B2Publication Date: 2010-11-02
- Inventor: An-Bang Wang , I-Chun Lin , Yi-Hua Wang , Chih-Kung Lee
- Applicant: An-Bang Wang , I-Chun Lin , Yi-Hua Wang , Chih-Kung Lee
- Applicant Address: TW Taipei
- Assignee: National Taiwan University
- Current Assignee: National Taiwan University
- Current Assignee Address: TW Taipei
- Agency: Rosenberg, Klein & Lee
- Priority: TW95147343A 20061215
- Main IPC: B05B7/08
- IPC: B05B7/08 ; B05B7/06 ; B05D1/26 ; B05D5/00 ; B67D7/52

Abstract:
A micro patch coating device includes a coating die with a micro channel structure. A coating fluid is supplied through a coating fluid inlet and an auxiliary fluid is supplied through an auxiliary fluid inlet. After a segment of a predetermined length of the coating fluid is formed at a two-phase fluid output section, the coating fluid flow is intercepted. In turn, a segment of predetermined length of the auxiliary fluid is formed at the two-phase fluid output section, and then the auxiliary fluid flow is intercepted. A two-phase fluid is formed and flows out of the coating die to the substrate to form micro patches thereon.
Public/Granted literature
- US20080145537A1 Micro patch coating device and method Public/Granted day:2008-06-19
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