Invention Grant
- Patent Title: Multi-layer polymeric film for packaging ovenable meals
- Patent Title (中): 用于包装可烘烤餐具的多层聚合物膜
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Application No.: US10489457Application Date: 2002-09-23
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Publication No.: US07824749B2Publication Date: 2010-11-02
- Inventor: Mark Edward Dawes
- Applicant: Mark Edward Dawes
- Applicant Address: US DE Wilmington
- Assignee: Dupont Teijin Films U.S. Limited Partnership
- Current Assignee: Dupont Teijin Films U.S. Limited Partnership
- Current Assignee Address: US DE Wilmington
- Agency: RatnerPrestia
- Priority: GB0122937.6 20010924; GB0210379.4 20020507
- International Application: PCT/GB02/04304 WO 20020923
- International Announcement: WO03/026892 WO 20030403
- Main IPC: B32B27/00
- IPC: B32B27/00 ; B32B27/06 ; B32B27/08 ; B65D65/40 ; B65D81/34

Abstract:
A heat-sealable peelable multi-layer laminated polymeric film comprising a polymeric substrate layer having on one side thereof a polymeric heat-sealable peelable layer and having on the opposite side thereof a polymeric shrinkable layer, wherein said shrinkable layer has a degree of shrinkage in a first dimension of about 10-80% over the temperature range 55 to 100° C., a ratio of shrinkage at 100° C. said first dimension relative to a second, orthogonal dimension in the range of 1:1 to 10:1, and further comprising one or two intermediate layer(s) wherein an intermediate layer is disposed between the substrate layer and the shrinkable layer and/or between the substrate layer and the heat-sealable peelable layer, and one or more layer(s) of an electrically conductive material; and use thereof as packaging for ovenable meals or as a lid on an ovenable container wherein the packaging is self-peeling and self-venturing during a cooking cycle.
Public/Granted literature
- US20050031814A1 Multi-layer polymeric film for packaging ovenable meals Public/Granted day:2005-02-10
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