Invention Grant
- Patent Title: Plated material and electric and electronic parts using the plated material
- Patent Title (中): 电镀材料和电子电器部件采用电镀材料
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Application No.: US12222919Application Date: 2008-08-19
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Publication No.: US07824776B2Publication Date: 2010-11-02
- Inventor: Kazuo Yoshida , Kyota Susai
- Applicant: Kazuo Yoshida , Kyota Susai
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-042834 20060220; JP2007-038697 20070219
- Main IPC: C25D5/50
- IPC: C25D5/50 ; H01R13/03 ; B32B15/20
Abstract:
A plated material 5, containing: on a conductive substrate 1, an underlayer 2 composed of nickel and the like; an intermediate layer 3 composed of Cu or a Cu alloy being provided thereon; and an outermost layer 4 composed of a Cu—Sn intermetallic compound being provided thereon; and an electric or electronic part using the same.
Public/Granted literature
- US20090061253A1 Plated material and electronic and elctronic parts using the plated material Public/Granted day:2009-03-05
Information query
