Invention Grant
- Patent Title: Composition for low dielectric material, low dielectric material and method for production thereof
- Patent Title (中): 用于低介电材料，低介电材料的组合物及其制备方法
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Application No.: US12327117Application Date: 2008-12-03
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Publication No.: US07824784B2Publication Date: 2010-11-02
- Inventor: Teruhiko Kumada , Hideharu Nobutoki , Tetsuya Yamamoto , Takuya Kamiyama
- Applicant: Teruhiko Kumada , Hideharu Nobutoki , Tetsuya Yamamoto , Takuya Kamiyama
- Applicant Address: JP Tokyo JP Osaka
- Assignee: Mitsubishi Denki Kabushiki Kaisha,Nippon Shokubai Co., Ltd.
- Current Assignee: Mitsubishi Denki Kabushiki Kaisha,Nippon Shokubai Co., Ltd.
- Current Assignee Address: JP Tokyo JP Osaka
- Agency: Porzio, Bromberg & Newman, P.C.
- Priority: JP2003-401199 20031201; JP2003-401200 20031201
- Main IPC: B05D1/00
- IPC: B05D1/00 ; B32B9/00
Abstract:
A low dielectric material is produced by using a composition including a borazine ring-containing compound and a compound represented by the following formula as a solvent, and/or by annealing a composition comprising a borazine ring-containing compound under atmosphere of oxygen concentration not higher than 0.1 vol % at 200 to 600° C. In the following formula, Ra and Rc independently represent alkyl group or acyl group; Rb represents hydrogen atom or alkyl group; and n represents an integer of 1 to 5.
Public/Granted literature
- US20090090274A1 COMPOSITION FOR LOW DIELECTRIC MATERIAL, LOW DIELECTRIC MATERIAL AND METHOD FOR PRODUCTION THEREOF Public/Granted day:2009-04-09
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