Invention Grant
US07824825B2 Stencil masks, method of manufacturing stencil masks, and method of using stencil masks 失效
模板掩模,制造模板掩模的方法以及使用模板掩模的方法

Stencil masks, method of manufacturing stencil masks, and method of using stencil masks
Abstract:
The present invention presents a stencil mask in which various surface patterns can be formed, and in which deformation is suppressed when charged particles are introduced. A stencil mask of the present invention is provided with a semiconductor stack. A first penetrating hole corresponding to an ion introducing area is formed in a first semiconductor layer of the semiconductor stack, and second penetrating holes are formed in a second semiconductor layer, these second penetrating holes having a width greater than the width of the first penetrating hole. The first penetrating hole and the second penetrating holes communicate and pass through the semiconductor stack. Beam members extending between adjacent second penetrating holes connect portions of the first semiconductor layer separated by the first penetrating hole.
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