Invention Grant
- Patent Title: Substrate processing apparatus, parameter management system for substrate processing apparatus, parameter management method for substrate processing apparatus, program, and storage medium
- Patent Title (中): 基板处理装置，基板处理装置的参数管理系统，基板处理装置的参数管理方法，程序和存储介质
-
Application No.: US11620261Application Date: 2007-01-05
-
Publication No.: US07824934B2Publication Date: 2010-11-02
- Inventor: Yoshihiro Yamamoto , Yoshiyuki Nakamura
- Applicant: Yoshihiro Yamamoto , Yoshiyuki Nakamura
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-048475 20060224
- Main IPC: H01L21/66
- IPC: H01L21/66
Abstract:
A substrate processing apparatus which enables parameters for carrying out processing on substrates to be changed easily by a user. A storage device stores parameters that are for controlling the processing and are categorized into a plurality of categories. A control device carries out the processing on the substrate based on the parameters. A parameter changing device enables each of the parameters to be changed in accordance with the category of that parameter. A parameter category changing device changes the category of some of the parameters. A category change defining device is detachable from the substrate processing apparatus and specifies parameters whose category is to be changed out of the parameters. The parameter category changing device changes the category of each of the parameters specified by the category change defining device.
Public/Granted literature
Information query
IPC分类:
