A semiconductor die package. The semiconductor die package includes a semiconductor die having a first surface comprising a die contact region, and a second surface. It also includes a leadframe structure having a die attach pad and a lead structure, where the semiconductor die is attached to the die attach pad. It also includes a flex clip connector comprising a flexible insulator, a first electrical contact region, and a second electrical contact region. The first electrical contact region of the flex clip connector is coupled to the die contact region and the second electrical contact region of the flex clip connector is coupled to the lead structure.