Invention Grant
- Patent Title: Method for manufacturing a constant current source device
- Patent Title (中): 恒流源装置的制造方法
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Application No.: US12252469Application Date: 2008-10-16
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Publication No.: US07824974B2Publication Date: 2010-11-02
- Inventor: Wei-Kuo Wu
- Applicant: Wei-Kuo Wu
- Applicant Address: CN Guangdong
- Assignee: Nanker (Guangzhou) Semiconductor Manufacturing Corp.
- Current Assignee: Nanker (Guangzhou) Semiconductor Manufacturing Corp.
- Current Assignee Address: CN Guangdong
- Agency: Kamrath & Associates PA
- Agent Alan Kamrath
- Priority: CN200710031759 20071128
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A constant current source device with over current and over voltage protection function can be directly applied to AC power and DC power, and a method for manufacturing the constant current source device is also disclosed. The device includes a silicon substrate (1), an oxide layer (6) formed in front of the silicon substrate (1), a drain metal (2), a source metal (3) and a gate metal (4) located in front of the oxide layer (6), a P+ guard ring (50), an N+ drain region (52) and an N+ source region (53) implanted in the silicon substrate (1), a P+ substrate region (51) located in the N+ source region (53), and an N− channel region (54) connecting the N+ drain region (52) with the N+ source region (53). The drain metal (2) and the source metal (3) are separately connected with the N+ drain region (52), the N+ source region (53) and the P+ substrate region (51). The source metal (3) and the gate metal (4) are electrically connected through a connection metal (7). The invention constant current source device is generally applied to the field of electronic devices.
Public/Granted literature
- US20090134474A1 Constant Current Source Device and Method for Manufacturing The Same Public/Granted day:2009-05-28
Information query
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