Invention Grant
- Patent Title: Semiconductor apparatus and method of manufacturing the semiconductor apparatus
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12654559Application Date: 2009-12-23
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Publication No.: US07824976B2Publication Date: 2010-11-02
- Inventor: Akio Kaneko , Kazuhiro Eguchi , Seiji Inumiya , Katsuyuki Sekine , Motoyuki Sato
- Applicant: Akio Kaneko , Kazuhiro Eguchi , Seiji Inumiya , Katsuyuki Sekine , Motoyuki Sato
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2003-305779 20030829
- Main IPC: H01L21/8249
- IPC: H01L21/8249

Abstract:
A semiconductor apparatus wherein a device formed on a semiconductor substrate comprises a gate insulating film including a high dielectric constant film formed on the substrate and an anti-reaction film formed on the high dielectric constant film, and a gate electrode formed on the anti-reaction film, the high dielectric constant film comprises a film containing at least one of Hf and Zr, and Si and O, or a film containing at least one of Hf and Zr, and Si, O and N, the anti-reaction film comprises an SiO2 film, a film containing SiO2 as a main component and at least one of Hf and Zr, a film containing SiO2 as a main component and N, a film containing SiO2 as a main component, Hf and N, a film containing SiO2 as a main component, Zr and N, or a film containing SiO2 as a main component, Hf, Zr and N.
Public/Granted literature
- US20100173487A1 Semiconductor apparatus and method of manufacturing the semiconductor apparatus Public/Granted day:2010-07-08
Information query
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