Invention Grant
US07824987B2 Method of manufacturing a semiconductor device including a SRAM section and a logic circuit section
有权
制造包括SRAM部分和逻辑电路部分的半导体器件的方法
- Patent Title: Method of manufacturing a semiconductor device including a SRAM section and a logic circuit section
- Patent Title (中): 制造包括SRAM部分和逻辑电路部分的半导体器件的方法
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Application No.: US12539203Application Date: 2009-08-11
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Publication No.: US07824987B2Publication Date: 2010-11-02
- Inventor: Tokuhiko Tamaki , Naoki Kotani , Shinji Takeoka
- Applicant: Tokuhiko Tamaki , Naoki Kotani , Shinji Takeoka
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-217341 20060809
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/336

Abstract:
A semiconductor device including a SRAM section and a logic circuit section includes: a first n-type MIS transistor including a first n-type gate electrode formed with a first gate insulating film interposed on a first element formation region of a semiconductor substrate in the SRAM section; and a second n-type MIS transistor including a second n-type gate electrode formed with a second gate insulating film interposed on a second element formation region of the semiconductor substrate in the logic circuit section. A first impurity concentration of a first n-type impurity in the first n-type gate electrode is lower than a second impurity concentration of a second n-type impurity in the second n-type gate electrode.
Public/Granted literature
- US20090298255A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-12-03
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