Invention Grant
- Patent Title: Method of manufacturing an interconnection structure
- Patent Title (中): 制造互连结构的方法
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Application No.: US11702697Application Date: 2007-02-05
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Publication No.: US07825023B2Publication Date: 2010-11-02
- Inventor: Didier Louis
- Applicant: Didier Louis
- Applicant Address: FR Paris
- Assignee: Commissariat a L'Energie Atomique
- Current Assignee: Commissariat a L'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Nixon Peabody LLP
- Priority: FR0650443 20060208
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L21/4763
Abstract:
This invention relates to a process for manufacturing interconnection structures, including: a) the formation on a substrate of a first layer comprising one or several conducting zones (24) and one or several insulating zones made of an organic material (26), b) coverage of this first layer by a porous layer (28), c) consumption and elimination of at least part of the organic material through the porous layer, using enzymes and/or proteins.
Public/Granted literature
- US20070275261A1 Interconnection structure and manufacturing process Public/Granted day:2007-11-29
Information query
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