Invention Grant
- Patent Title: Method of forming a spacer
- Patent Title (中): 形成间隔物的方法
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Application No.: US12277332Application Date: 2008-11-25
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Publication No.: US07825030B2Publication Date: 2010-11-02
- Inventor: Yu-Kyung Kim , Kun-Tack Lee , Woo-Gwan Shim , Chang-Ki Hong
- Applicant: Yu-Kyung Kim , Kun-Tack Lee , Woo-Gwan Shim , Chang-Ki Hong
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine & Whitt, PLLC
- Priority: KR10-2007-0121269 20071127
- Main IPC: H01L21/311
- IPC: H01L21/311

Abstract:
A sacrificial layer and wet etch are used to form a sidewall spacer so as to prevent damage to the structure on which the spacer is formed and to the underlying substrate as well. Once the structure is formed on the substrate a spacer formation layer is formed to cover the structure, and a sacrificial layer is formed on the spacer formation layer. The sacrificial layer is wet etched to form a sacrificial layer pattern on that portion of the spacer formation layer extending along a sidewall of the structure. The spacer is formed on the sidewall of the structure by wet etching the spacer formation layer using the sacrificial layer pattern as a mask.
Public/Granted literature
- US20090137126A1 METHOD OF FORMING A SPACER Public/Granted day:2009-05-28
Information query
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