Invention Grant
- Patent Title: Addition cure silicone rubber adhesive composition and making method
- Patent Title (中): 添加固化硅橡胶胶的组成及制作方法
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Application No.: US12003366Application Date: 2007-12-21
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Publication No.: US07825177B2Publication Date: 2010-11-02
- Inventor: Hiroyasu Hara
- Applicant: Hiroyasu Hara
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2006-348970 20061226
- Main IPC: C08K5/541
- IPC: C08K5/541 ; C08K3/10

Abstract:
An addition cure silicone rubber adhesive composition comprising (A) an organopolysiloxane, (B) an inorganic filler, (C) an alkoxysilane, (D) a hydrolytic catalyst selected from titanium, zirconium and aluminum compounds, (E) an organohydrogenpolysiloxane, (F) a cure regulator, and (G) a platinum compound is prepared by mixing components (A), (B), (C) and (D), in the absence of component (G), at 0-200° C. and a reduced pressure to form a premix, and thereafter, adding component (G) and the remaining components to the premix and mixing at 0-60° C. and a reduced pressure.
Public/Granted literature
- US20080153956A1 Addition cure silicone rubber adhesive composition and making method Public/Granted day:2008-06-26
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