Invention Grant
- Patent Title: Thermoplastic elastomer with acyloxyphenyl hard block segment
- Patent Title (中): 具有酰氧基苯基硬嵌段的热塑性弹性体
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Application No.: US11960683Application Date: 2007-12-19
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Publication No.: US07825188B2Publication Date: 2010-11-02
- Inventor: Stephen M Dershem
- Applicant: Stephen M Dershem
- Applicant Address: US CA San Diego
- Assignee: Designer Molecules, Inc.
- Current Assignee: Designer Molecules, Inc.
- Current Assignee Address: US CA San Diego
- Agency: The Law Office of Jane K. Babin, Professional Corporation
- Agent Jane K. Babin
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L63/02 ; C08L63/04 ; C08L53/00
Abstract:
The present invention provides curatives for thermosetting adhesive compositions, methods of preparation and uses thereof. In particular, the present invention relates to elastomeric epoxy curative compounds that can be used in thermosetting compounds, methods for preparing the curative compounds and epoxy compositions containing the curative compounds.
Public/Granted literature
- US20080146738A1 RUBBER EPOXY CURATIVES AND METHODS FOR USE THEREOF Public/Granted day:2008-06-19
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