Invention Grant
US07825198B2 Thermosetting resin composition and multilayer printed wiring board using the same
有权
热固性树脂组合物和使用其的多层印刷线路板
- Patent Title: Thermosetting resin composition and multilayer printed wiring board using the same
- Patent Title (中): 热固性树脂组合物和使用其的多层印刷线路板
-
Application No.: US11525019Application Date: 2006-09-22
-
Publication No.: US07825198B2Publication Date: 2010-11-02
- Inventor: Masao Arima , Makoto Hayashi , Koshin Nakai
- Applicant: Masao Arima , Makoto Hayashi , Koshin Nakai
- Applicant Address: JP Tokyo
- Assignee: Taiyo Ink Mfg. Co., Ltd.
- Current Assignee: Taiyo Ink Mfg. Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-100866 20040330
- Main IPC: C08G59/14
- IPC: C08G59/14 ; C08G63/91 ; C08G59/40 ; C08G59/42 ; C08G65/00 ; C08G59/00 ; C08G63/00 ; C08L67/00

Abstract:
A thermosetting resin composition comprising (A) a thermoplastic resin having a structure represented by the following general formula (a) and/or a structure represented by the following general formula (b) in which 5 to 99 mol % of hydroxyl groups of polyhydroxyether are esterified, and (B) a thermosetting resin: wherein R1 represents C1-18 aliphatic or aromatic-ring-containing alkylene group or —SO2—, 5 to 99 mol % of R2 represent a straight chain or cyclic carbonyl group or aromatic carbonyl group having 1 to 20 carbon atoms, the residue 95 to 1 mol % represent a hydrogen atom, and R3 represents a hydrogen atom or a methyl group, with a proviso that a plurality of R3's may be the same or different.
Public/Granted literature
- US20070015872A1 Thermosetting resin composition and multilayer printed wiring board using the same Public/Granted day:2007-01-18
Information query