Invention Grant
- Patent Title: Double-sided wiring board, manufacturing method of double-sided wiring board, and mounting double-sided wiring board
- Patent Title (中): 双面接线板,双面接线板的制造方法和安装双面接线板
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Application No.: US12193492Application Date: 2008-08-18
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Publication No.: US07825340B2Publication Date: 2010-11-02
- Inventor: Hitoshi Kashio
- Applicant: Hitoshi Kashio
- Applicant Address: JP Osaka-shi
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2007-304774 20071126
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
In one embodiment of the present invention, a connecting device of a double-sided wiring board includes a first-side connecting land portion configured by a first-side conductive layer and a first-side connecting conductive layer and a second-side connecting land portion configured by a second-side conductive layer; the first-side connecting land portion and the second-side connecting land portion face each other at respective central portions with an insulating substrate sandwiched therebetween; a substrate hole is formed corresponding to a peripheral end portion of the first-side connecting land portion and a peripheral end portion of the second-side connecting land portion; and the peripheral end portion of the first-side connecting land portion and the peripheral end portion of the second-side connecting land portion are connected to each other via the substrate hole.
Public/Granted literature
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