Invention Grant
- Patent Title: Strain-inducing semiconductor regions
- Patent Title (中): 应变诱导半导体区域
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Application No.: US11450745Application Date: 2006-06-09
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Publication No.: US07825400B2Publication Date: 2010-11-02
- Inventor: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant: Suman Datta , Jack T. Kavalieros , Been-Yih Jin
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/072 ; H01L31/109 ; H01L31/0328 ; H01L31/0336

Abstract:
A method to form a strain-inducing semiconductor region is described. In one embodiment, formation of a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In another embodiment, a semiconductor region with a crystalline lattice of one or more species of charge-neutral lattice-forming atoms imparts a strain to a crystalline substrate, wherein the lattice constant of the semiconductor region is different from that of the crystalline substrate, and wherein all species of charge-neutral lattice-forming atoms of the semiconductor region are contained in the crystalline substrate.
Public/Granted literature
- US20080142785A1 Strain-inducing semiconductor regions Public/Granted day:2008-06-19
Information query
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