Invention Grant
- Patent Title: Circuit board including a substrate with a recessed portion and manufacturing method thereof, electro-optical device and electronic apparatus
- Patent Title (中): 电路板,包括具有凹陷部分的基板及其制造方法,电光装置和电子设备
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Application No.: US11687898Application Date: 2007-03-19
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Publication No.: US07825403B2Publication Date: 2010-11-02
- Inventor: Takashi Aoki
- Applicant: Takashi Aoki
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2006-081714 20060323
- Main IPC: H01L35/24
- IPC: H01L35/24 ; H01L23/58

Abstract:
A circuit board includes: a substrate; source and drain electrodes formed on the substrate; an organic semiconductor layer formed on the source and drain electrodes; a gate insulating layer formed on the organic semiconductor layer; and a gate electrode formed on the gate insulating layer, wherein: the substrate includes a first part, a second part, and a third part interposed between the first and second parts and a thickness of the first part or a thickness of the second part is greater than that of the third part; the source electrode is formed on the first part; the drain electrode is formed on the second part; a part of the organic semiconductor layer is formed on the third part; and a thickness of the gate insulating layer disposed on the first and second parts is smaller than that of the gate insulating layer disposed on the third part.
Public/Granted literature
- US20070221958A1 CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPARATUS Public/Granted day:2007-09-27
Information query
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