Invention Grant
- Patent Title: Semiconductor device with a high breakdown voltage device
- Patent Title (中): 具有高击穿电压的半导体器件
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Application No.: US11852747Application Date: 2007-09-10
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Publication No.: US07825430B2Publication Date: 2010-11-02
- Inventor: Tomohide Terashima
- Applicant: Tomohide Terashima
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2007-104999 20070412
- Main IPC: H01L29/74
- IPC: H01L29/74 ; H01L31/111

Abstract:
An n− type semiconductor region is provided with an n− diffusion region serving as a drain region, and at one side of the n− diffusion region a p diffusion region and an n+ diffusion region serving as a source region are provided. At an other side of the n− diffusion region a trench is provided and has an insulator introduced therein. Immediately under the n− diffusion region a p− buried layer is provided. In a region of the n− semiconductor region an n+ diffusion region to which a high potential is applied is provided and electrically connected to the n− diffusion region by an interconnect having a resistor. On a surface of a portion of the p diffusion region that is sandwiched between the n+ diffusion region and the n− diffusion region a gate electrode is provided, with a gate insulation film posed therebetween.
Public/Granted literature
- US20080251811A1 SEMICONDUCTOR DEVICE Public/Granted day:2008-10-16
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