Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11709975Application Date: 2007-02-22
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Publication No.: US07825442B2Publication Date: 2010-11-02
- Inventor: Kiyofumi Nakaya
- Applicant: Kiyofumi Nakaya
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2006-048726 20060224
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
In a semiconductor device of the present invention, an N type epitaxial layer is formed on a P type silicon substrate. In the epitaxial layer, P type diffusion layers as a base region, N type diffusion layers as collector regions and an N type diffusion layer as an emitter region are formed. In this event, the P type diffusion layers are formed so as to have a double diffusion structure, and an impurity concentration in a surface of the base region and in a region adjacent thereto is set high. This structure enables improvement in high frequency characteristics and in a current amplification factor while maintaining breakdown voltage characteristics of an NPN transistor.
Public/Granted literature
- US20070221969A1 Semiconductor device and method of manufacturing the same Public/Granted day:2007-09-27
Information query
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