Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11347375Application Date: 2006-02-06
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Publication No.: US07825453B2Publication Date: 2010-11-02
- Inventor: Shoichi Miyazaki
- Applicant: Shoichi Miyazaki
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2005-086341 20050324
- Main IPC: H01L27/108
- IPC: H01L27/108

Abstract:
A semiconductor device includes a memory cell gate structure having a first gate insulating film, a first gate electrode, a second gate insulating film, and a second gate electrode, a select gate structure having a third gate insulating film and a third gate electrode including a first electrode portion, a second electrode portion, and a third electrode portion between the first electrode portion and the second electrode portion, a first impurity diffusion layer formed in a surface area of the semiconductor substrate and located at a portion which corresponds to an area between the memory cell gate structure and the first electrode portion, and a second impurity diffusion layer formed in a surface area of the semiconductor substrate and located at a portion which corresponds to an area between the first electrode portion and second electrode portion.
Public/Granted literature
- US20060214211A1 Semiconductor device and method for manufacturing the same Public/Granted day:2006-09-28
Information query
IPC分类: