Invention Grant
- Patent Title: Electrical antifuse having a multi-thickness dielectric layer
- Patent Title (中): 具有多层电介质层的电反熔丝
-
Application No.: US12187003Application Date: 2008-08-06
-
Publication No.: US07825479B2Publication Date: 2010-11-02
- Inventor: Roger A. Booth, Jr. , Kangguo Cheng , Chandrasekharan Kothandaraman , Chengwen Pei , Ravi M. Todi , Xiaojun Yu
- Applicant: Roger A. Booth, Jr. , Kangguo Cheng , Chandrasekharan Kothandaraman , Chengwen Pei , Ravi M. Todi , Xiaojun Yu
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Agent Joseph P. Abate, Esq.
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119

Abstract:
An electrical antifuse comprising a field effect transistor includes a gate dielectric having two gate dielectric portions. Upon application of electric field across the gate dielectric, the magnitude of the electrical field is locally enhanced at the boundary between the thick and thin gate dielectric portions due to the geometry, thereby allowing programming of the electrical antifuse at a lower supply voltage between the two electrodes, i.e., the body and the gate electrode of the transistor, across the gate dielectric.
Public/Granted literature
- US20100032732A1 ELECTRICAL ANTIFUSE HAVING A MULTI-THICKNESS DIELECTRIC LAYER Public/Granted day:2010-02-11
Information query
IPC分类: