Invention Grant
- Patent Title: Image sensor and method for manufacturing the same
- Patent Title (中): 图像传感器及其制造方法
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Application No.: US12336484Application Date: 2008-12-16
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Publication No.: US07825494B2Publication Date: 2010-11-02
- Inventor: Sung Ho Jun
- Applicant: Sung Ho Jun
- Applicant Address: KR Seoul
- Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee: Dongbu HiTek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: The Law Offices of Andrew D. Fortney
- Agent Andrew D. Fortney
- Priority: KR10-2007-0135956 20071222
- Main IPC: H01L31/00
- IPC: H01L31/00

Abstract:
An image sensor may include a dielectric, a metal interconnection, an align key, a first substrate, a photodiode, and a transparent electrode. The first substrate may include a pixel region, a peripheral circuitry region and a scribe lane. The dielectric may include a metal interconnection and an align key over the first substrate. The photodiode may be formed over the pixel region and the scribe lane. The transparent electrode may be formed over the photodiode. The align key may have a protrusion formed in a center thereof.
Public/Granted literature
- US20090159943A1 Image Sensor and Method for Manufacturing the Same Public/Granted day:2009-06-25
Information query
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