Invention Grant
- Patent Title: Covered devices in a semiconductor package
- Patent Title (中): 半导体封装中的覆盖器件
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Application No.: US12510177Application Date: 2009-07-27
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Publication No.: US07825503B2Publication Date: 2010-11-02
- Inventor: Gregory M. Chrysler , Tony A. Opheim
- Applicant: Gregory M. Chrysler , Tony A. Opheim
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A plurality of devices is attached to underside of the base plate. The devices have length corresponding to the height such that the devices are sealed within the cover when the cover is attached to a surface.
Public/Granted literature
- US20090289353A1 COVERED DEVICES IN A SEMICONDUCTOR PACKAGE Public/Granted day:2009-11-26
Information query
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