Invention Grant
US07825504B2 Semiconductor package and multi-chip semiconductor package using the same
有权
半导体封装和多芯片半导体封装采用相同
- Patent Title: Semiconductor package and multi-chip semiconductor package using the same
- Patent Title (中): 半导体封装和多芯片半导体封装采用相同
-
Application No.: US11852425Application Date: 2007-09-10
-
Publication No.: US07825504B2Publication Date: 2010-11-02
- Inventor: Jae Myun Kim
- Applicant: Jae Myun Kim
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2007-0063252 20070626
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
Disclosed is a semiconductor package and a multi-chip semiconductor package. The semiconductor package includes a semiconductor chip having bonding pads located at a center portion thereof; redistribution patterns extending from the bonding pads toward one edge of the semiconductor chip; and dummy bump pads located adjacent to another edge of the semiconductor chip which is opposite the one edge.
Public/Granted literature
- US20090001542A1 SEMICONDUCTOR PACKAGE AND MULTI-CHIP SEMICONDUCTOR PACKAGE USING THE SAME Public/Granted day:2009-01-01
Information query
IPC分类:
