Invention Grant
- Patent Title: Semiconductor package and method therefor
- Patent Title (中): 半导体封装及其方法
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Application No.: US12616453Application Date: 2009-11-11
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Publication No.: US07825505B2Publication Date: 2010-11-02
- Inventor: Phillip Celaya , James P. Letterman, Jr.
- Applicant: Phillip Celaya , James P. Letterman, Jr.
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Robert F. Hightower
- Main IPC: H01L23/498
- IPC: H01L23/498
Abstract:
In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package.
Public/Granted literature
- US20100052145A1 SEMICONDUCTOR PACKAGE AND METHOD THEREFOR Public/Granted day:2010-03-04
Information query
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