Invention Grant
US07825509B1 Transducer package with transducer die unsupported by a substrate
有权
带传感器管芯的传感器封装，不受衬底支撑
- Patent Title: Transducer package with transducer die unsupported by a substrate
- Patent Title (中): 带传感器管芯的传感器封装，不受衬底支撑
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Application No.: US12543309Application Date: 2009-08-18
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Publication No.: US07825509B1Publication Date: 2010-11-02
- Inventor: John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
- Applicant: John Charles Baumhauer, Jr. , Alan Dean Michel , Joshua R. Barber , Christopher Todd Welsh , Jeffrey Phillip McAteer
- Applicant Address: US IN Indianapolis
- Assignee: MWM Acoustics, LLC
- Current Assignee: MWM Acoustics, LLC
- Current Assignee Address: US IN Indianapolis
- Agency: Patent Law Office of David G. Beck
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.
Information query
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