Invention Grant
- Patent Title: Electronic package with compliant electrically-conductive ball interconnect
- Patent Title (中): 具有兼容导电球互连的电子封装
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Application No.: US11224919Application Date: 2005-09-12
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Publication No.: US07825512B2Publication Date: 2010-11-02
- Inventor: Weifeng Liu , John J. Lewis
- Applicant: Weifeng Liu , John J. Lewis
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/44 ; B23K31/02
Abstract:
An electronic device comprises a device substrate, a plurality of compliant electrically-conductive balls, and a plurality of solder joints that couple the compliant electrically-conductive balls to the device substrate by a reflow process.
Public/Granted literature
- US20070057382A1 Electronic package with compliant electrically-conductive ball interconnect Public/Granted day:2007-03-15
Information query
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